Method of manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component

ABSTRACT

A method of manufacturing a multilayer ceramic electronic component includes: preparing a dielectric magnetic composition including base material powder particles including BaTi2O5 or (Ba(1-x)Cax)Ti2O5 (0≤x&lt;0.1), the base material powder particles having surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal; preparing ceramic green sheets using dielectric slurry including the dielectric magnetic composition; applying an internal electrode paste to the ceramic green sheets; preparing a green sheet laminate by stacking the ceramic green sheets to which the internal electrode paste is applied; and preparing a ceramic body including dielectric layers and a plurality of first and second internal electrodes arranged to face each other with each of the dielectric layers interposed therebetween by sintering the green sheet laminate.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority to Korean PatentApplication No. 10-2018-0118729 filed on Oct. 5, 2018 in the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein by reference in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a method of manufacturing a multilayerceramic electronic component and a multilayer ceramic electroniccomponent, and more particularly, to a method of manufacturing amultilayer ceramic electronic component and a multilayer ceramicelectronic component capable of having excellent reliability and a highcapacitance.

2. Description of Related Art

Recently, in accordance with miniaturization, slimness, andmultifunctionalization of electronic products, miniaturization ofmultilayer ceramic capacitors has also been required, and multilayerceramic capacitors have also been mounted at a high degree ofintegration.

A multilayer ceramic capacitor, an electronic component, is mounted on aprinted circuit boards of several electronic products including an imagedisplay device, for example, a liquid crystal display (LCD), a plasmadisplay panel (PDP), and the like, a computer, a personal digitalassistants (PDA), a cellular phone, and the like, to serve to charge ordischarge electricity therein or therefrom.

The multilayer ceramic capacitor may be used as a component of variouselectronic apparatuses since it has a small size, implements highcapacitance, and may be easily mounted.

Meanwhile, recently, in accordance with an increase in interest inelectrical components in industry, multilayer ceramic capacitors havealso been required to have high reliability and high capacitancecharacteristics in order to be used in a vehicle or an infotainmentsystem.

Particularly, in accordance with an increase in an electronic controlsystem of an internal combustion engine vehicle and an electric vehicle,demand for a multilayer ceramic capacitor that may be used in a hightemperature environment has increased.

Currently, a dielectric material of a multilayer ceramic capacitorhaving a high capacitance is mainly barium titanate (BaTiO₃), and sincenickel (Ni) internal electrodes are used and a ceramic body needs to besintered under a reducing atmosphere, the dielectric material needs tohave reduction resistance.

However, as capacitance is significantly decreased in an environment of150° C. or more due to unique characteristics of barium titanate(BaTiO₃) oxide, it is difficult to secure electrical characteristicsdepending on a temperature required by electrical components.

In addition, it is impossible to use the multilayer ceramic capacitor inan environment up to 200° C. Therefore, the development of a multilayerceramic capacitor that may be used even in a high temperatureenvironment by applying a new composition has been required.

SUMMARY

An aspect of the present disclosure may provide a method ofmanufacturing a multilayer ceramic electronic component and a multilayerceramic electronic component capable of having excellent reliability andhaving a high capacitance.

According to an aspect of the present disclosure, a method ofmanufacturing a multilayer ceramic electronic component may include:preparing a dielectric magnetic composition including base materialpowder particles represented by BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅(0≤x<0.1), the base material powder particles having surfaces coatedwith one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal;preparing ceramic green sheets using dielectric slurry including thedielectric magnetic composition; applying an internal electrode paste tothe ceramic green sheets; preparing a green sheet laminate by stackingthe ceramic green sheets to which the internal electrode paste isapplied; and preparing a ceramic body including dielectric layers and aplurality of first and second internal electrodes arranged to face eachother with each of the dielectric layers interposed therebetween bysintering the green sheet laminate.

According to another aspect of the present disclosure, a multilayerceramic electronic component may include: a ceramic body includingdielectric layers and a plurality of first and second internalelectrodes arranged to face each other with each of the dielectriclayers interposed therebetween and having first and second surfacesopposing each other in a first direction, third and fourth surfacesconnected to the first and second surfaces and opposing each other in asecond direction, and fifth and sixth surfaces connected to the first tofourth surfaces and opposing each other in a third direction; and firstand second external electrodes disposed on external surfaces of theceramic body and electrically connected to the plurality of first andsecond internal electrodes, respectively, wherein each of the dielectriclayers includes a dielectric magnetic composition including basematerial powder particles represented by BaTi₂O₅ or(Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), the base material powder particleshaving surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al and arare earth metal.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view illustrating a multilayer ceramic capacitoraccording to an exemplary embodiment in the present disclosure;

FIG. 2 is a schematic view illustrating a ceramic body according to anexemplary embodiment in the present disclosure;

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1according to an exemplary embodiment in the present disclosure;

FIG. 4 is an enlarged view of region B of FIG. 3; and

FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 1according to another exemplary embodiment in the present disclosure.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will now bedescribed in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a multilayer ceramic capacitoraccording to an exemplary embodiment in the present disclosure.

FIG. 2 is a schematic view illustrating a ceramic body according to anexemplary embodiment in the present disclosure.

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1according to an exemplary embodiment in the present disclosure.

FIG. 4 is an enlarged view of region B of FIG. 3.

Referring to FIGS. 1 through 4, a multilayer ceramic electroniccomponent 100 manufactured by a method of manufacturing a multilayerceramic electronic component according to an exemplary embodiment in thepresent disclosure may include a ceramic body 110 including dielectriclayers 111 and a plurality of first and second internal electrodes 121and 122 arranged to face each other with each of the dielectric layers111 interposed therebetween and having first and second surfaces S1 andS2 opposing each other in a first direction, third and fourth surfacesS3 and S4 connected to the first and second surfaces S1 and S2 andopposing each other in a second direction, and fifth and sixth surfacesS5 and S6 connected to the first to fourth surfaces and opposing eachother in a third direction; and first and second external electrodes 131and 132 disposed on external surfaces of the ceramic body 110 andelectrically connected to the plurality of first and second internalelectrodes 121 and 122, respectively.

A multilayer ceramic electronic component according to an exemplaryembodiment in the present disclosure, particularly, a multilayer ceramiccapacitor will hereinafter be described. However, the multilayer ceramicelectronic component according to the present disclosure is not limitedthereto.

In the multilayer ceramic capacitor according to an exemplary embodimentin the present disclosure, a ‘length direction’ refers to an ‘L’direction of FIG. 1, a ‘width direction’ refers to a ‘W’ direction ofFIG. 1, and a ‘thickness direction’ refers to a ‘T’ direction of FIG. 1.Here, the ‘thickness direction’ refers to a direction in which thedielectric layers are stacked, that is, a ‘stacking direction’.

In an exemplary embodiment in the present disclosure, a shape of theceramic body 110 is not particularly limited, and may be a hexahedralshape as illustrated.

The ceramic body 110 may have the first and second surfaces S1 and S2opposing each other in the first direction, the third and fourthsurfaces S3 and S4 connected to the first and second surfaces S1 and S2and opposing each other in the second direction, and the fifth and sixthsurfaces S5 and S6 connected to the first to fourth surfaces andopposing each other in the third direction.

The first and second surfaces S1 and S2 refer to surfaces of the ceramicbody 110 opposing each other in the thickness direction, which is thefirst direction, the third and fourth surfaces S3 and S4 refer tosurfaces of the ceramic body 110 opposing each other in the lengthdirection, which is the second direction, and the fifth and sixthsurfaces S5 and S6 refer to surfaces of the ceramic body 110 opposingeach other in the width direction, which is the third direction.

One ends of the plurality of first and second internal electrodes 121and 122 formed in the ceramic body 110 may be exposed to the thirdsurface S3 or the fourth surface S4 of the ceramic body.

The internal electrodes 121 and 122 may have a pair of first and secondinternal electrodes 121 and 122 having different polarities.

One ends of the first internal electrodes 121 may be exposed to thethird surface S3, and one ends of the second internal electrodes 122 maybe exposed to the fourth surface S4.

The other ends of the first internal electrodes 121 and the secondinternal electrodes 122 may be formed to be spaced apart from the fourthsurface S4 or the third surface S3 by a predetermined interval. Moredetailed contents for this will be described below.

The first and second external electrodes 131 and 132 may be formed onthe third and fourth surfaces S3 and S4 of the ceramic body,respectively, and may be electrically connected to the internalelectrodes.

The ceramic body 110 may include an active portion A contributing toforming capacitance of the multilayer ceramic capacitor, and upper andlower cover portions C1 and C2 formed as upper and lower margin portionson upper and lower surfaces of the active portion A, respectively.

The active portion A may be formed by repeatedly stacking a plurality offirst and second internal electrodes 121 and 122 with each of thedielectric layers 111 interposed therebetween.

The upper and lower cover portions C1 and C2 may be formed of the samematerial as that of the dielectric layer 111 and have the sameconfiguration as that of the dielectric layer 111 except that they donot include the internal electrodes.

That is, the upper and lower cover portions C1 and C2 may include aceramic material such as a barium titanate (BaTiO₃)-based ceramicmaterial.

The upper and lower cover portions C1 and C2 may be formed by stacking asingle dielectric layer or two or more dielectric layers on the upperand lower surfaces of the active portion A, respectively, in a verticaldirection, and may basically serve to prevent damage to the internalelectrodes due to physical or chemical stress.

A material of each of the first and second internal electrodes 121 and122 is not particularly limited, but may be a conductive paste includingone or more of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), andcopper (Cu).

According to an exemplary embodiment in the present disclosure, themultilayer ceramic capacitor may include the first external electrode131 electrically connected to the first internal electrodes 121 and thesecond external electrode 132 electrically connected to the secondinternal electrodes 122.

The first and second external electrodes 131 and 132 may be electricallyconnected to the first and second internal electrodes 121 and 122,respectively, in order to form a capacitance, and the second externalelectrode 132 may be connected to a potential different to a potentialto which the first external electrode 131 is connected.

The first and second external electrodes 131 and 132 may be disposed,respectively, on the third and fourth surfaces S3 and S4 of the ceramicbody 110 in the length direction, which is the second direction, and mayextend to the first and second surfaces S1 and S2 of the ceramic body110 in the thickness direction, which is the first direction.

The external electrodes 131 and 132 may include, respectively, electrodelayers 131 a and 132 a disposed on the external surfaces of the ceramicbody 110 and electrically connected to the internal electrodes 121 and122, respectively, and conductive resin layers 131 b and 132 b disposedon the electrode layers 131 a and 132 a, respectively.

The electrode layers 131 a and 132 a may include a conductive metal anda glass.

The conductive metal used in the electrode layers 131 a and 132 a may beany material that may be electrically connected to the internalelectrodes in order to form the capacitance, for example, one or moreselected from the group consisting of copper (Cu), silver (Ag), nickel(Ni), and alloys thereof.

The electrode layers 131 a and 132 a may be formed by applying and thensintering a conductive paste prepared by adding glass frit to conductivemetal powder particles.

The conductive resin layers 131 b and 132 b may be formed on theelectrode layers 131 a and 132 a, respectively, and may be formed tocompletely cover the electrode layers 131 a and 132 a, respectively.

Since the conductive resin layers 131 b and 132 b are formed tocompletely cover the electrode layers 131 a and 132 a, respectively,distances of the conductive resin layers 131 b and 132 b formed on thefirst and second surfaces S1 and S2 of the ceramic body 110 up to endportions may be greater than those of the electrode layers 131 a and 132a formed on the first and second surfaces S1 and S2 of the ceramic body110 up to the end portions.

A base resin included in each of the conductive resin layers 131 b and132 b may have a bonding property and a shock absorbing property, may beany resin that may be mixed with conductive metal powder particles toform a paste, and may include, for example, an epoxy-based resin.

A conductive metal included in each of the conductive resin layers 131 band 132 b may be any material that may be electrically connected to theelectrode layers 131 a and 132 a, and may include, for example, one ormore selected from the group consisting of copper (Cu), silver (Ag),nickel (Ni), and alloys thereof.

Plating layers 131 c and 131 d, and 132 c and 132 d may further bedisposed on the conductive resin layers 131 b and 132 b, respectively.

The plating layers 131 c and 131 d, and 132 c and 132 d may be disposedon the conductive resin layers 131 b and 132 b, respectively, and bedisposed to completely cover the conductive resin layers 131 b and 132b, respectively.

The plating layers 131 c and 131 d, and 132 c and 132 d may includenickel (Ni) plating layers 131 c and 132 c disposed on the conductiveresin layers 131 b and 132 b, respectively, and palladium (Pd) platinglayers 131 d and 132 d disposed on the nickel (Ni) plating layers 131 cand 132 c, respectively.

The multilayer ceramic capacitor 100 may be manufactured by a method ofmanufacturing a multilayer ceramic electronic component according to anexemplary embodiment in the present disclosure. The method ofmanufacturing a multilayer ceramic electronic component according to anexemplary embodiment in the present disclosure may include preparing adielectric magnetic composition including base material powder particlesrepresented by BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), the basematerial powder particles having surfaces coated with one or more of Mg,Mn, V, Ba, Si, Al and a rare earth metal; preparing ceramic green sheetsusing dielectric slurry including the dielectric magnetic composition;applying an internal electrode paste to the ceramic green sheets;preparing a green sheet laminate by stacking the ceramic green sheets towhich the internal electrode paste is applied; and preparing a ceramicbody including dielectric layers and a plurality of first and secondinternal electrodes arranged to face each other with each of thedielectric layers interposed therebetween by sintering the green sheetlaminate.

Recently, in accordance with an increase in an interest in electricalcomponents in the industry, the multilayer ceramic capacitors have alsobeen required to have high reliability and high capacitancecharacteristics in order to be used in a vehicle or an infotainmentsystem.

Particularly, in accordance with an increase in an electronic controlsystem in an internal combustion engine vehicle and an electric vehicle,a demand for a multilayer ceramic capacitor that may be used in a hightemperature environment has increased.

Currently, a dielectric material of a multilayer ceramic capacitorhaving a high capacitance is mainly barium titanate (BaTiO₃), and sincenickel (Ni) internal electrodes are used and a ceramic body needs to besintered under a reducing atmosphere, the dielectric material needs tohave reduction resistance.

However, as a capacitance is significantly decreased in an environmentof 150° C. or more due to unique characteristics of barium titanate(BaTiO₃) oxide, it is difficult to secure electrical characteristicsdepending on a temperature required by electrical components.

In addition, it is impossible to use the multilayer ceramic capacitor inan environment up to 200° C. Therefore, the development of a multilayerceramic capacitor that may be used even in a high temperatureenvironment by applying a new composition has been required.

According to an exemplary embodiment in the present disclosure, themultilayer ceramic capacitor may be manufactured using the dielectricmagnetic composition including the base material powder particlesrepresented by BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1) and havingthe surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al and a rareearth metal, such that a high-temperature capacitance change rate may bestably secured and a high-capacitance multilayer ceramic capacitor maybe implemented.

The respective components of the dielectric magnetic compositionincluded in the dielectric layer according to an exemplary embodiment inthe present disclosure will hereinafter be described in more detail.

a) Base Material Powder

According to an exemplary embodiment in the present disclosure, thedielectric magnetic composition may include the base material powderparticles represented by BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1).

The dielectric magnetic composition may include the base material powderparticles represented by BaTi₂O₅, may include the base material powderparticles represented by (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), or mayinclude a form in which the respective base material powder particlesrepresented by BaTi₂O₅ and (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1) are mixedwith each other.

The base material powder represented by BaTi₂O₅ or(Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1) may have a ferroelectric transitiontemperature higher than that of BaTiO₃, which is a base material powderincluded in a general dielectric magnetic composition.

For example, BaTi₂O₅ may be controlled to have a ferroelectrictransition temperature up to 470° C., and (Ba_((1-x))Ca_(x))Ti₂O₅ may becontrolled to have a ferroelectric transition temperature of 220 to 470°C.

Therefore, when the base material powder particles represented byBaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1) are used as a maincomponent, a high-temperature capacitance change rate may be stablysecured by high ferroelectric transition temperature characteristics.

However, when the base material powder particles represented by BaTi₂O₅or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1) are used as the main component, anamount of titanium (Ti) may be larger than that of BaTiO₃ according tothe related art, such that a problem that titanium (Ti) reacts withnickel (Ni) constituting the internal electrode and nickel (Ni) isdiffused into the dielectric layer occurs.

In detail, since a larger amount of TiO₂ than that of BaTiO₃ is added atthe time of synthesizing BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅, unreactedTiO₂ or a Ti-rich secondary phase may remain after the synthesis.

Since the unreacted TiO₂ or the Ti-rich secondary phase has a highreactivity to nickel (Ni) included in the internal electrode, nickel(Ni) may be diffused into the dielectric layer, and in a severe case, aproblem that the internal electrode disappears may occur.

Therefore, there may be a problem that a dielectric constant of themultilayer ceramic capacitor is decreased.

That is, when the base material powder particles represented by BaTi₂O₅or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1) are used as the main component, thehigh-temperature capacitance change rate may be stably secured by thehigh ferroelectric transition temperature characteristics, but theproblem that the dielectric constant of the multilayer ceramic capacitoris decreased may occur.

Therefore, in order to stably secure the high-temperature capacitancechange rate and implement the high-capacitance multilayer ceramiccapacitor, in an exemplary embodiment in the present disclosure, thedielectric magnetic composition may include the base material powderparticles represented by BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1)and having the surfaces coated with one or more of Mg, Mn, V, Ba, Si, Aland a rare earth metal.

In detail, one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metalmay be coated on the surfaces of the base material powder particlesrepresented by BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1) to prevent acontact between nickel (Ni) and titanium (Ti) in a heat treatmentprocess to thus solve the problem that nickel (Ni) is diffused into thedielectric layer or the internal electrode disappears.

That is, the base material powder particles having the surfaces coatedwith one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal mayprevent formation of a Ti—Ni reaction layer by reaction to the internalelectrode including nickel (Ni) to increase a dielectric constant.

In addition, the Ti—Ni reaction layer may be decreased to solve problemssuch as an increase in a dissipation factor (DF), a decrease in aspecific resistance, and the like.

Meanwhile, one or more of Mg, Mn, V, Ba, Si, Al and a rare earth metalmay be coated on the surfaces of the base material powder particles in acontent of 2 parts by mol or less based on 100 parts by mol of Ti ofelements of the base material powder particles.

One or more of Mg, Mn, V, Ba, Si, Al and a rare earth metal may becoated on the surface of the base material powder particles in thecontent of 2 parts by mol or less based on 100 parts by mol of Ti of theelements of the base material powder particles to prevent the contactbetween nickel (Ni) and titanium (Ti) in the heat treatment process tothus prevent the problem that nickel (Ni) is diffused into thedielectric layer or the internal electrode disappears, such that thehigh-temperature capacitance change rate may be stably secured and thehigh-capacitance multilayer ceramic capacitor may be implemented.

When one or more of Mg, Mn, V, Ba, Si, Al and a rare earth element arecoated on the surfaces of the base material powder particles in acontent exceeding 2 parts by mol or less based on 100 parts by mol of Tiof the elements of the base material powder particles, it may bedifficult to stably secure the high-temperature capacitance change rate,such that it may be difficult to use the multilayer ceramic capacitor ata high temperature.

The rare earth element may be one or more selected from the groupconsisting of Y, Dy, Ho, La, Ce, Nd, Sm, Gd, and Er, but is notnecessarily limited thereto.

Meanwhile, in the base material powder particles represented by(Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), 0≤x<0.1.

That is, in a first main component, Ca may include 0 mol %, and may beincluded in a content less than 10 mol %.

More preferably, in the first main component, Ca may include 0 mol %,and may be included in a content of 7 mol % or less. Therefore, 0≤x≤0.7.

x may be 0 or more, and when x is 0, the first main component may beBaTi₂O₅.

The base material powder particles are not particularly limited, and mayhave an average particle size of 150 nm or less.

b) First Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric magnetic composition may further include an oxide or acarbonate including at least one of Mn, V, Cr, Fe, Ni, Co, Cu, and Zn asa first accessory component.

A content of the oxide or the carbonate including at least one of Mn, V,Cr, Fe, Ni, Co, Cu and Zn, which is included as the first accessorycomponent, may be 0.1 to 2.0 mol % based on 100 mol % of the basematerial powder particles.

The first accessory component may serve to decrease a sinteringtemperature of a multilayer ceramic capacitor in which the dielectricmagnetic composition is used and to improve high-temperature withstandvoltage characteristics of the multilayer ceramic capacitor.

The content of the first accessory component and a content of a secondaccessory component to be described below may be contents based on 100mol % of the base material powder particles, and may be definedparticularly as mol % of metal ions included in the respective accessorycomponents.

When the content of the first accessory component is less than 0.1 mol%, a sintering temperature of the multilayer ceramic capacitor may beincreased and high-temperature withstand voltage characteristics of themultilayer ceramic capacitor may be deteriorated to some degree.

When the content of the first accessory component is 2.0 mol % or more,high-temperature withstand voltage characteristics and aroom-temperature specific resistance of the multilayer ceramic capacitormay be deteriorated.

Particularly, the dielectric magnetic component according to anexemplary embodiment in the present disclosure may further include thefirst accessory component having the content of 0.1 to 2.0 mol % basedon 100 mol % of the base material powder particles. Therefore, themultilayer ceramic capacitor may be sintered at a low temperature, andthe high-temperature withstand voltage characteristics of the multilayerceramic capacitor may be obtained.

c) Second Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric magnetic composition may include an oxide including Si or aglass compound including Si, as a second accessory component.

The dielectric magnetic composition may further include the secondaccessory component which is the oxide including Si or the glasscompound including Si and has a content of 0.2 to 5.0 mol % based on 100mol % of the base material powder particles.

The second accessory component may serve to decrease a sinteringtemperature of the multilayer ceramic capacitor in which the dielectricmagnetic composition is used and to improve high-temperature withstandvoltage characteristics of the multilayer ceramic capacitor.

When the content of the second accessory component is less than 0.2 mol% based on 100 mol % of the base material powder particles, thesintering temperature of the multilayer ceramic capacitor may beincreased.

When the content of the second accessory component is 5.0 mol % or morebased on 100 mol % of the base material powder particles, thehigh-temperature withstand voltage characteristics of the multilayerceramic capacitor may be deteriorated.

Particularly, the dielectric magnetic component according to anexemplary embodiment in the present disclosure may further include thesecond accessory component having the content of 0.2 to 5.0 mol % basedon 100 mol % of the base material powder particles. Therefore, themultilayer ceramic capacitor may be sintered at a low temperature, andthe high-temperature withstand voltage characteristics of the multilayerceramic capacitor may be obtained.

d) Third Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric magnetic composition may further include a third accessorycomponent, which is an oxide, a carbonate, or a fluoride including Li.

The dielectric magnetic composition may further include the thirdaccessory component which is the oxide, the carbonate, or the fluorideincluding Li and has a content of 0.4 to 12.0 mol % based on 100 mol %of the base material powder particles.

The third accessory component may serve to decrease a sinteringtemperature of the multilayer ceramic capacitor in which the dielectricmagnetic composition is used and to improve high-temperature withstandvoltage characteristics of the multilayer ceramic capacitor.

In addition, the third accessory component may obtain targetcharacteristics of the multilayer ceramic capacitor even in a case inwhich copper (Cu) is used as a material of the internal electrode.

When the content of the third accessory component is less than 0.4 mol %based on 100 mol % of the base material powder particles, a sinteringtemperature of the multilayer ceramic capacitor may be increased, adielectric constant of the multilayer ceramic capacitor may be low, andthe high-temperature withstand voltage characteristics of the multilayerceramic capacitor may be deteriorated.

When the content of the third accessory component is 12.0 mol % or morebased on 100 mol % of the base material powder particles, thehigh-temperature withstand voltage characteristics of the multilayerceramic capacitor may be deteriorated due to generation of a secondaryphase, or the like.

Particularly, the dielectric magnetic component according to anexemplary embodiment in the present disclosure may further include thethird accessory component having the content of 0.4 to 12.0 mol % basedon 100 mol % of the base material powder particles. Therefore, copper(Cu) may be used as the material of the internal electrode, themultilayer ceramic capacitor may be sintered at a low temperature, andthe high-temperature withstand voltage characteristics of the multilayerceramic capacitor may be obtained.

e) Fourth Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric magnetic composition may further include a fourth accessorycomponent, which is an oxide, a carbonate, or a fluoride including Ba.

The dielectric magnetic composition may further include the fourthaccessory component which is the oxide, the carbonate, or the fluorideincluding Ba of which a content is 0 to 3.0 at % based on 100 mol % ofthe base material powder particles.

The fourth accessory component may serve to increase a dielectricconstant of the multilayer ceramic capacitor in which the dielectricmagnetic composition is used.

In addition, the fourth accessory component may obtain targetcharacteristics of the multilayer ceramic capacitor even in a case inwhich copper (Cu) is used as a material of the internal electrode andthe multilayer ceramic capacitor is sintered under a reducing atmosphere(N₂ atmosphere).

When the content of Ba of the fourth accessory component exceeds 3.0 at% based on 100 mol % of the base material powder particles, thehigh-temperature withstand voltage characteristics of the multilayerceramic capacitor may be deteriorated.

Particularly, the dielectric magnetic component according to anexemplary embodiment in the present disclosure may further include thefourth accessory component which is the oxide, the carbonate, or thefluoride including Ba of which the content is 0 to 3.0 at % based on 100mol % of the base material powder. Therefore, copper (Cu) may be used asthe material of the internal electrode, the multilayer ceramic capacitormay be sintered under the reducing atmosphere, and the high dielectricconstant and the high-temperature withstand voltage characteristics ofthe multilayer ceramic capacitor may be obtained.

Meanwhile, according to an exemplary embodiment in the presentdisclosure, the fourth accessory component may include Ba so that amolar ratio between Ba and Si is 0 to 4.0.

When a molar ratio between the second accessory component including theoxide including Si or the glass compound including Si and the fourthaccessory component is controlled to satisfy 0 to 4.0, a high dielectricconstant of the multilayer ceramic capacitor may be obtained, andexcellent high-temperature withstand voltage characteristics of themultilayer ceramic capacitor may be obtained.

In detail, even in a case in which the content of Ba of the fourthaccessory component, which is the oxide, the carbonate, or the fluorideincluding Ba, exceeds 3.0 at %, when the molar ratio between Ba and Siis controlled to be 4.0 by increasing a content of Si, which is thesecond accessory component, the high-temperature withstand voltagecharacteristics of the multilayer ceramic capacitor may be improved.

However, when the molar ratio between Ba and Si exceeds 4.0, thewithstand voltage characteristics of the multilayer ceramic capacitormay be deteriorated, and a problem may occur in reliability.

f) Fifth Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric magnetic composition may include a fifth accessory component,which is an oxide, a carbonate, or a fluoride including at least one ofDy, Y, Ho, Sm, Gd, Er, La, and Tb.

The dielectric magnetic composition may further include the fifthaccessory component which is the oxide, the carbonate, or the fluorideincluding at least one of Dy, Y, Ho, Sm, Gd, Er, La, and Tb each ofwhich a content is 0 to 4.0 at % based on 100 mol % of the base materialpowder particles.

The fifth accessory component may serve to improve direct current (DC)bias characteristics of the multilayer ceramic capacitor in which thedielectric magnetic composition is used and to improve ahigh-temperature withstand voltage of the multilayer ceramic capacitorto improve reliability.

When the content of each element of the fifth accessory componentexceeds 4.0 at % based on 100 mol % of the base material powderparticles, a room-temperature dielectric constant may be decreased toimplement target characteristics.

Particularly, the dielectric magnetic composition according to anexemplary embodiment in the present disclosure may further include thefifth accessory component which is the oxide, the carbonate, or thefluoride including at least one of Dy, Y, Ho, Sm, Gd, Er, La, and Tbeach of which a content is 0 to 4.0 at % based on 100 mol % of the basematerial powder particles. Therefore, the DC bias characteristics of themultilayer ceramic capacitor may be improved, and the high-temperaturewithstand voltage may be increased to improve the reliability.

In the method of manufacturing a multilayer ceramic electronic componentaccording to an exemplary embodiment in the present disclosure, thedielectric magnetic composition including the base material powderparticles represented by BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1)and having the surfaces coated with one or more of Mg, Mn, V, Ba, Si, Aland a rare earth metal may first be prepared.

As the base material powder particles represented by BaTi₂O₅ or(Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), powder particles having an averageparticle size of 150 nm or less may be used.

A method of coating one or more of Mg, Mn, V, Ba, Si, Al and a rareearth metal on the surfaces of the base material powder particles is notparticularly limited, and may be performed by, for example, performingheat treatment on the base material powder particles co-doped with oneor more of Mg, Mn, V, Ba, Si, Al and a rare earth metal at 1200° C., andwet-milling and then drying the base material powder particles formedafter the heat treatment.

An additive such as Sn, Mn, or the like, a binder, and an organicsolvent such as ethanol, or the like, are added to and wet-mixed withthe coated base material powder particles, to prepare dielectric slurry.Then, the dielectric slurry are applied and dried onto carrier films toform a plurality of ceramic green sheets.

Therefore, dielectric layers may be formed.

Next, a conductive paste for an internal electrode including 40 to 50parts by weight of nickel powder particles having an average particlesize of 0.1 to 0.2 μm may be prepared.

The conductive paste for an internal electrode is applied onto theceramic green sheets by a screen printing method to form the internalelectrodes, the ceramic green sheets on which internal electrodepatterns are disposed are stacked to form a green sheet laminate, andthe green sheet laminate is then compressed and cut.

Then, the cut green sheet laminate is heated to remove the binder and issintered under a high-temperature reducing atmosphere to form a ceramicbody.

The ceramic body may include dielectric layers and a plurality of firstand second internal electrodes arranged to face each other with each ofthe dielectric layers interposed therebetween.

In the sintering process, the sintering is performed under a reducingatmosphere (an atmosphere of 0.1% H₂/99.9% N₂ and H₂O/H₂/N₂).

Then, electrode layers including one or more conductive metals selectedfrom the group consisting of copper (Cu), silver (Ag), nickel (Ni), andalloys thereof, and a glass may be formed on external surfaces of theceramic body.

The glass is not particularly limited, but may be a material having thesame composition as that of a glass used to manufacture an externalelectrode of a general multilayer ceramic capacitor.

The electrode layers may be formed on upper and lower surfaces and endportions of the ceramic body to be electrically connected to the firstand second internal electrodes, respectively.

The electrode layer may include 5% by volume or more of glass relativeto the conductive metal.

Then, the conductive resin layers 131 b and 132 b may be formed byapplying a conductive resin composition to the electrode layers 131 aand 132 a and then hardening the conductive resin composition.

The conductive resin layer 131 b and 132 b may include one or moreconductive metals selected from the group consisting of copper (Cu),silver (Ag), nickel (Ni), and alloys thereof, and a base resin. The baseresin may be an epoxy resin.

Then, the nickel (Ni) plating layers 131 c and 132 c may be formed onthe conductive resin layers 131 b and 132 b, respectively, and thepalladium (Pd) plating layers 131 d and 132 d may be formed on thenickel (Ni) plating layers 131 c and 132 c, respectively.

A multilayer ceramic electronic component 100 according to anotherexemplary embodiment in the present disclosure may include a ceramicbody 110 including dielectric layers 111 and a plurality of first andsecond internal electrodes 121 and 122 arranged to face each other witheach of the dielectric layers 111 interposed therebetween and havingfirst and second surfaces S1 and S2 opposing each other in a firstdirection, third and fourth surfaces S3 and S4 connected to the firstand second surfaces S1 and S2 and opposing each other in a seconddirection, and fifth and sixth surfaces S5 and S6 connected to the firstto fourth surfaces and opposing each other in a third direction; andfirst and second external electrodes 131 and 132 disposed on externalsurfaces of the ceramic body 110 and electrically connected to theplurality of first and second internal electrodes 121 and 122,respectively, wherein each of the dielectric layers 111 includes adielectric magnetic composition including base material powder particlesrepresented by BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), the basematerial powder particles having surfaces coated with one or more of Mg,Mn, V, Ba, S Al and a rare earth metal.

Referring to FIG. 4, t2>t3 in which t3 is a thickness of a region of thedielectric layer 111 in which a content of nickel (Ni) is 3 wt % or lessfrom a boundary of each of the first and second internal electrodes 121and 122 and t2 is a thickness of each of the first and second internalelectrodes 121 and 122.

According to the present exemplary embodiment, the surfaces of the basematerial powder particles including BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅(0≤x<0.1) may be coated with one or more of Mg, Mn, V, Ba, Si, Al and arare earth metal, and the thickness t3 of the region of the dielectriclayer 111 in which the content of nickel (Ni) is 3 wt % or less may thusbe smaller than the thickness t2 of each of the first and secondinternal electrodes 121 and 122.

As described above, a problem that nickel (Ni) is diffused into thedielectric layer may be significantly suppressed to prevent a decreasein a dielectric constant, such that a high-capacitance multilayerceramic capacitor may be implemented.

Referring to FIG. 4, in the multilayer ceramic electronic componentaccording to another exemplary embodiment in the present disclosure,t1>2×t2 in which t1 is a thickness of the dielectric layer 111 and t2 isthe thickness of each of the internal electrodes 121 and 122.

That is, according to another exemplary embodiment in the presentdisclosure, the thickness t1 of the dielectric layer 111 may be greaterthan two times the thickness t2 of each of the internal electrodes 121and 122.

Generally, in a high-voltage electrical component, a reliability problemdepending on a decrease in a break-down voltage under a high voltageenvironment may be important.

In the multilayer ceramic capacitor according to another exemplaryembodiment in the present disclosure, the thickness t1 of the dielectriclayer 111 may be set to be greater than two times the thickness t2 ofeach of the internal electrodes 121 and 122 in order to prevent adecrease in a break-down voltage under a high voltage environment. Thatis, the thickness of the dielectric layer, which is a distance betweenthe internal electrodes, may be increased to improve break-down voltagecharacteristics.

When the thickness t1 of the dielectric layer 111 is equal to or lessthan two times the thickness t2 of each of the internal electrodes 121and 122, the thickness of the dielectric layer, which is the distancebetween the internal electrodes, may be small, such that a break-downvoltage may be decreased.

The thickness t2 of the internal electrode may be less than 2 μm, andthe thickness t1 of the dielectric layer may be less than 10.0 μm.However, the thickness t2 of the internal electrode and the thickness t1of the dielectric layer are not necessarily limited thereto.

FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 1according to another exemplary embodiment in the present disclosure.

Referring to FIG. 5, a multilayer ceramic capacitor according to thepresent exemplary embodiment may further include a plurality of floatingelectrodes 123 arranged in the ceramic body 110 to be offset from thefirst and second internal electrodes 121′ and 122′ in the thicknessdirection and having opposite end portions overlapping, respectively,portions of the first and second internal electrodes 121′ and 122′.

The first and second internal electrodes 121′ and 122′, which havedifferent polarities, may be simultaneously formed on at least onesurfaces of ceramic sheets forming the dielectric layers 111 to bespaced apart from each other, and may be arranged in the ceramic body110 to be exposed through opposite end surfaces of the ceramic body 110,respectively.

The first and second internal electrodes 121′ and 122′ exposed throughthe opposite end surfaces of the ceramic body 110, respectively, may beelectrically connected to the first and second external electrodes 131and 132, respectively.

The plurality of floating electrodes 123 and the first and secondinternal electrodes 121′ and 122′ may be arranged in the ceramic body110 to be offset from each other in the thickness direction of theceramic body 110, and portions of opposite end portions of the pluralityof floating electrodes 123 may overlap, respectively, end portions ofthe first and second internal electrodes 121′ and 122′ spaced apart fromeach other.

Each of distances at which the plurality of floating electrodes 123 arespaced apart from the opposite end surfaces of the ceramic body 110 maybe 5% or more of an entire length of the ceramic body 110.

Meanwhile, according to another exemplary embodiment in the presentdisclosure, first and second dummy electrodes 124 a and 124 b spacedapart from each other may be arranged in an upper cover portion C1 and alower cover portion C2 disposed, respectively, on upper and lowersurfaces of an active portion A.

The first dummy electrodes 124 a may be exposed to the same surface asan external surface of the ceramic body 110 to which the first internalelectrodes 121′ are exposed, and the second dummy electrodes 124 b maybe exposed to the same surface as an external surface of the ceramicbody 110 to which the second internal electrodes 122′ are exposed.

The first dummy electrodes 124 a may be exposed to the same surface asthe external surface of the ceramic body 110 to which the first internalelectrodes 121′ are exposed, and the second dummy electrodes 124 b maybe exposed to the same surface as the external surface of the ceramicbody 110 to which the second internal electrodes 122′ are exposed, suchthat warpage strength of the multilayer ceramic capacitor may beimproved.

As set forth above, according to an exemplary embodiment in the presentdisclosure, the multilayer ceramic capacitor may be manufactured usingthe dielectric magnetic composition including the base material powderparticles including BaTi₂O₅ or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1) andhaving the surfaces coated with one or more of Mg, Mn, V, Ba, Si, Al anda rare earth metal, such that a high-temperature capacitance change ratemay be stably secured and a high-capacitance multilayer ceramiccapacitor may be implemented.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A method of manufacturing a multilayer ceramicelectronic component, comprising: preparing a dielectric magneticcomposition including base material powder particles including BaTi₂O₅or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), the base material powder particleshaving surfaces coated with at least one selected from the group of Mg,Mn, V, Ba, Si, Al and a rare earth metal; preparing ceramic green sheetsusing dielectric slurry including the dielectric magnetic composition;applying an internal electrode paste to the ceramic green sheets;preparing a green sheet laminate by stacking the ceramic green sheets towhich the internal electrode paste is applied; and preparing a ceramicbody including dielectric layers and a plurality of first and secondinternal electrodes arranged to face each other with each of thedielectric layers interposed therebetween by sintering the green sheetlaminate.
 2. The method of claim 1, wherein a content of the at leastone selected from the group of Mg, Mn, V, Ba, Si, Al and a rare earthmetal is 2 parts by mol or less based on 100 parts by mol of Ti ofelements of the base material powder particles.
 3. The method of claim1, wherein the base material powder particles have surfaces coated withthe rare earth metal, and the rare earth metal includes at least oneselected from the group consisting of Y, Dy, Ho, La, Ce, Nd, Sm, Gd, andEr.
 4. The method of claim 1, wherein 0≤x≤0.07.
 5. The method of claim1, wherein the dielectric layer has a thickness less than 10.0 μm. 6.The method of claim 1, wherein each of the first and second internalelectrodes has a thickness less than 2 μm.
 7. The method of claim 1,wherein t1>2×t2 in which t1 is a thickness of the dielectric layer, andt2 is a thickness of each of the first and second internal electrodes.8. The method of claim 1, wherein t2>t3, where t3 is a thickness of aregion of the dielectric layer in which a content of nickel (Ni) is 3 wt% or less from a boundary of each of the first and second internalelectrodes, and t2 is a thickness of each of the first and secondinternal electrodes.
 9. The method of claim 1, wherein a plurality offloating electrodes are further arranged in the ceramic body to beoffset from the first and second internal electrodes in a thicknessdirection, and have opposite end portions overlapping, respectively,portions of the first and second internal electrodes.
 10. The method ofclaim 1, wherein the ceramic body includes an active portion includingthe plurality of first and second internal electrodes disposed to faceeach other and cover portions formed on upper and lower surfaces of theactive portion, respectively, and first and second dummy electrodes arearranged in the cover portions to be spaced apart from each other. 11.The method of claim 10, wherein the first dummy electrodes are exposedto the same surface as a surface of the ceramic body to which the firstinternal electrodes are exposed, and the second dummy electrodes areexposed to the same surface as a surface of the ceramic body to whichthe second internal electrodes are exposed.
 12. The method of claim 1,further comprising, after the preparing of the ceramic body, formingexternal electrodes on external surfaces of the ceramic body.
 13. Themethod of claim 12, wherein the external electrodes include electrodelayers electrically connected to the first and second internalelectrodes, conductive resin layers disposed on the electrode layers,and plating layers disposed on the conductive resin layers,respectively.
 14. The method of claim 13, wherein the plating layersinclude nickel (Ni) plating layers disposed on the conductive resinlayers and palladium (Pd) plating layers disposed on the nickel (Ni)plating layers, respectively.
 15. The method of claim 1, wherein thebase material powder particles have an average particle size of 150 nmor less.
 16. A multilayer ceramic electronic component comprising: aceramic body including dielectric layers and a plurality of first andsecond internal electrodes arranged to face each other with each of thedielectric layers interposed therebetween and having first and secondsurfaces opposing each other in a first direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother in a second direction, and fifth and sixth surfaces connected tothe first to fourth surfaces and opposing each other in a thirddirection; and first and second external electrodes disposed on externalsurfaces of the ceramic body and electrically connected to the pluralityof first and second internal electrodes, respectively, wherein each ofthe dielectric layers includes a dielectric magnetic compositionincluding base material powder particles including BaTi₂O₅ or(Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), the base material powder particleshaving surfaces coated with at least one selected from the group of Mg,Mn, V, Ba, Si, Al and a rare earth metal.
 17. A dielectric magneticcomposition including base material powder particles including BaTi₂O₅or (Ba_((1-x))Ca_(x))Ti₂O₅ (0≤x<0.1), the base material powder particleshaving surfaces coated with at least one selected from the group of Mg,Mn, V, Ba, Si, Al and a rare earth metal.
 18. The dielectric magneticcomposition of claim 17, wherein a content of the at least one selectedfrom the group of Mg, Mn, V, Ba, Si, Al and a rare earth metal is 2parts by mol or less based on 100 parts by mol of Ti of elements of thebase material powder particles.
 19. The dielectric magnetic compositionof claim 17, wherein the base material powder particles have surfacescoated with the rare earth metal, and the rare earth metal includes atleast one selected from the group consisting of Y, Dy, Ho, La, Ce, Nd,Sm, Gd, and Er.